IoT Modules Assembly

At TESCOM, we specialise in building compact, high-density IoT modules that demand seamless integration of wireless communication and control electronics. Our engineering-led manufacturing approach enables precise assembly of RF modules, microcontrollers, sensor interfaces, and power management circuits using a combination of advanced SMT and selective THT processes. Every product is optimised for signal integrity through controlled-impedance design, RF shielding, and carefully engineered antenna integration—ensuring reliable, stable wireless performance under real-world operating conditions.

Our capabilities span a wide spectrum of wireless technologies, including Wi-Fi, BLE, GNSS, LTE, NB-IoT, and LoRa, supporting diverse connected-device ecosystems. With MES-driven manufacturing, we ensure end-to-end traceability and process control, reinforced by automated optical inspection, X-ray analysis, in-circuit testing, and functional RF validation. This structured, quality-first approach enables consistent production, regulatory readiness, and scalable manufacturing—empowering industries across industrial, automotive, and consumer IoT to bring robust, high-performance connected products to market with confidence.