Quality Is Engineered In, Not Inspected In
Quality is not something we verify at the end—it is deliberately built into every step of our process. We embed rigorous quality principles from the earliest design stages through to final assembly, ensuring each decision supports reliability and performance. By combining design-for-manufacturability expertise, precision-driven production, and continuous in -process monitoring, we create systems where consistency is inherent, not enforced. This structured, forward-thinking approach allows us to deliver dependable, high-performance electronics that consistently meet demanding global benchmarks, even at scale.
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Our Success, Told by Clients
Founder’s Note - V. Balasubramani
At TESCOM, our journey began with a clear conviction: exceptional engineering is rooted in precision and guided by integrity. From day one, we have focused on achieving zero-defect manufacturing while earning trust through every product we deliver.
As we expand our global presence, we remain committed to developing talent, encouraging innovation, and advancing manufacturing capabilities that showcase India's rising technological strength. Sustainability is embedded in our approach, shaping responsible and forward-looking practices across all operations.
Together, we are creating a cohesive ecosystem where quality, people, and purpose come together—positioning TESCOM as a trusted global benchmark for reliability and engineering excellence.
TESCOM in numbers
years of industry experience
Placed Per Hour
Skilled professionals
Across 5 facilities (Bangalore, Hosur, Coimbatore, Chennai, Kotadwara)
Waste to Landfill (ELCiTA Initiative)
Our Process, Engineered for Excellence
From meticulous planning to final dispatch, our integrated workflow guarantees precision, quality and reliability at every stage of production.
Warehouse excellence
Our warehouse function plays a critical role in enabling uninterrupted manufacturing through precise control of components and materials. With well-structured inventory systems, standardised storage practices, and timely material issuance, we ensure a seamless and efficient production flow. End-to-end tracking, regular reconciliation, and effective scrap management provide complete traceability while optimising costs. This disciplined approach keeps operations agile and ensures consistent manufacturing readiness across all programs.
Incoming Quality Control (IQC)
The Incoming Quality Control (IQC) function serves as the first checkpoint in ensuring manufacturing excellence, verifying that all incoming components and materials fully comply with defined quality and regulatory standards before they are released to production. By implementing structured inspection processes, rigorous testing protocols, comprehensive documentation, and thorough supplier validation, IQC proactively eliminates defects at the source. This disciplined approach strengthens material traceability, safeguards product integrity, and ensures a stable, interruption-free manufacturing flow.
Pre-Engineering
Pre-engineering establishes a strong foundation for production readiness by thoroughly evaluating customer designs, bills of materials, and process requirements at the outset. By identifying potential risks early and applying design-for-manufacturability principles, we ensure that products are optimised for efficient and reliable production. Through detailed validation and clear process definition, pre-engineering aligns engineering, quality, and manufacturing teams from the beginning, creating a unified execution framework. This proactive approach minimizes rework, enhances process stability, and enables predictable, scalable manufacturing outcomes with consistent efficiency.
Surface Mount Technology
Our SMT department forms the backbone of TESCOM's electronics assembly operations, purpose-built to handle high-mix, high-volume production with exceptional precision and consistency. Leveraging advanced SMT lines—ranging from accurate solder paste printing to high-speed, high-precision pick-and-place systems and tightly controlled reflow processes—we ensure stable and repeatable assembly performance across diverse product builds. Integrated in-line AOI systems, closed-loop process controls, and real-time data monitoring create a highly responsive manufacturing environment that drives high yields and minimises defects. This robust, technology-driven approach enables us to meet stringent quality standards while delivering reliable, complex electronic assemblies at scale.
Through- Hole technology
The THT (Through-Hole Technology) capability at TESCOM ensures robust and reliable assembly of through-hole components through precisely controlled soldering processes, including wave, selective, and robotic soldering. Each method is optimized to achieve consistent solder joint quality while maintaining strong mechanical integrity and dependable electrical connections. Supported by integrated inspection systems and well-defined process controls, this function delivers stable performance and repeatable outcomes across applications. The result is enhanced durability and long-term reliability, making it well-suited for high-duty and mission-critical environments.
Box Build Assembly
Box-build assembly at TESCOM represents the complete system-level integration of electronic sub-assemblies into fully finished, deployment-ready products. This includes comprehensive wiring, mechanical integration, enclosure assembly, functional testing, labelling, and final quality validation. Driven by a structured and standardised approach, our box-build process ensures consistency, reliability, and seamless integration across every unit. By delivering fully assembled and verified systems, we help OEMs streamline their supply chains, reduce complexity, and accelerate time-to-market with confidence.
Testing
Testing at TESCOM is a critical assurance function that safeguards product quality and functional reliability at every stage of manufacturing. Through a structured approach that includes in-circuit testing, functional verification, and comprehensive final system validation, we ensure that each assembly performs precisely as intended and meets defined specifications. By integrating testing seamlessly into the production process, we enable early detection of potential issues, minimize defects, and maintain consistent performance across all builds. This proactive and systematic methodology ensures the delivery of highly reliable, fully validated electronic assemblies ready for real-world deployment.
Quality Inspection
PCB quality inspection at TESCOM is a comprehensive and multi-layered process designed to ensure the highest levels of assembly accuracy and product integrity. By combining skilled manual evaluation with advanced automated inspection technologies, we achieve precise detection and control of potential defects across every stage of assembly. Detailed visual and magnified inspections identify surface-level issues such as solder imperfections, missing or misaligned components, and physical damage. Automated Optical Inspection (AOI) further enhances accuracy by consistently and quickly verifying component placement, solder joint quality, and polarity. Complementing this, in-circuit testing (ICT) and functional testing validate electrical connectivity and overall performance against defined specifications. For complex assemblies, X-ray inspection provides critical visibility into hidden areas, detecting defects in BGAs and other concealed solder joints that are inaccessible by conventional methods. This integrated inspection approach ensures early defect detection, robust quality assurance, and the delivery of reliable, high-performance PCB assemblies that meet stringent industry standards.
Box Build, Integration & Functional Test
Final system assembly including cable harnessing, enclosure integration, and comprehensive functional validation.